Semtech Corporation announced on September 8, 2025, the launch of two new FiberEdge® transimpedance amplifiers (TIAs), the GN1834D and GN1818, designed to address power efficiency challenges in AI-driven data center scaling. The GN1834D supports the emerging 1.6T optical interconnect market, while the GN1818 optimizes 800G infrastructure with up to 20% power reduction, reinforcing Semtech’s leadership in signal integrity solutions.
Announcement: Semtech unveiled GN1834D and GN1818 TIAs on September 8, 2025.
GN1834D: Enables 1.6T optical interconnects with 200G per channel and 2.5D mounting.
GN1818: Reduces power consumption by up to 20% for 800G infrastructure.
Market Impact: Supports AI-driven bandwidth growth, with datacom market projected to grow from $9B in 2024 to $17B by 2026.
Availability: Both TIAs are available for sampling; demos at CIOE 2025 in Shenzhen.
Applications: Hyperscale AI data centers, optical modules, and signal integrity solutions.
As AI workloads drive exponential bandwidth growth toward 1.6T infrastructure, power consumption has become a critical constraint. Semtech’s FiberEdge TIAs tackle this challenge head-on. The GN1834D, part of Semtech’s 200G TIA portfolio, enables 8x200G optical modules for 1.6T throughput, using advanced 2.5D mounting technology to minimize parasitic effects and enhance signal integrity. The GN1818, optimized for 100G, delivers up to 20% power reduction, extending the lifespan of 800G infrastructure while maintaining low latency and high performance for AI applications.
“The 1.6T inflection point is upon us,” said Amit Thakar, vice president of signal integrity product marketing at Semtech. “Our expanded 200G TIA portfolio provides the performance, power efficiency, and design flexibility that module designers need to deliver tomorrow’s innovative optical interconnect solutions today.”
The GN1834D is engineered for the emerging 1.6T market, supporting 200G per channel performance. Its hybrid 2.5D mounting combines flip chip technology at the photodetector-to-TIA interface with wire bond outputs, reducing parasitic effects and ensuring superior signal integrity. This makes it a cornerstone for hyperscale operators scaling AI cluster connectivity.
The GN1818 targets operators extending 800G deployments, offering:
20% Power Reduction: Low-power design for sustainable operations.
Compact 250μm Pitch: Maximizes port density in space-constrained modules.
Proven Performance: Maintains signal integrity and low latency for AI workloads.
Heritage: Built on Semtech’s trusted TIA design principles.
This power optimization supports cost-effective transitions to 1.6T while extending the value of existing infrastructure.
The high-speed datacom transceiver market is projected to grow from $9 billion in 2024 to over $17 billion by 2026, driven by AI-driven demand for 200G per lane optics, as noted by Scott Wilkinson of Cignal AI. Semtech’s comprehensive 200G TIA portfolio, including the GN1834D, GN1832, GN1834, and GN1836, offers design flexibility and single-supplier standardization, enabling module manufacturers to optimize for diverse applications.
Semtech’s stock (SMTC) was priced at $42.47 on September 8, 2025, with a market cap of $2.73 billion, reflecting a 2.21% intraday gain, signaling investor confidence in its AI infrastructure innovations.
Semtech will showcase its optical solutions, including the GN1834D and GN1818, at CIOE 2025 in Shenzhen, China (Booth #11C52), demonstrating their role in next-generation AI infrastructure scaling. Both TIAs are now available for sampling.
Semtech Corporation (Nasdaq: SMTC) is a leading provider of high-performance semiconductor, IoT systems, and cloud connectivity solutions, dedicated to enabling a smarter, more connected, and sustainable planet.
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