Qualcomm Technologies, Inc. has announced a multi-generational product collaboration with Amazon to build next-generation AI data center infrastructure at scale. The collaboration will focus on customized silicon for large-scale AI inference workloads and advanced optical connectivity solutions for high-bandwidth interconnects within Amazon data center networks. The initiative addresses the exponential growth of AI workloads driving unprecedented demand for compute, storage, networking, memory bandwidth, and energy-efficient infrastructure.
Quick Intel
Qualcomm Technologies and Amazon will work together across multiple generations of customized silicon to support AWS's growing AI infrastructure. The focus is on enabling large-scale AI inference with power-efficient processing and system-level integration. As AI workloads grow exponentially, the collaboration aims to deliver greater performance with more efficiency by combining Amazon's comprehensive AI infrastructure with Qualcomm's four decades of innovation in advanced processing and low-power compute.
The companies will also collaborate on high-performance optical connectivity solutions designed to support the growing scale and bandwidth demands of AI infrastructure. The solutions will leverage Qualcomm Technologies' advanced SerDes and optical DSP technologies to support high-bandwidth interconnects within Amazon data center networks, extending up to 1.6T and future-generation solutions.
As part of the expanded collaboration, Qualcomm Technologies plans to deepen its use of AWS AI infrastructure, including Amazon Bedrock, for electronic design automation workloads, targeting a reduction in chip design cycles. The partnership builds on a strong foundation to deliver more performant, efficient, and cost-effective infrastructure for customers.
"As AI demand accelerates, data center infrastructure will require advances in both computing and connectivity to deliver greater performance with more efficiency," said Cristiano Amon, President and CEO, Qualcomm Incorporated. "Qualcomm is pleased to work with AWS on customized silicon and connectivity solutions, bringing decades of leadership in advanced processing and power-efficient compute, to deliver breakthrough performance and enable the next generation of AI infrastructure."
"This collaboration with Qualcomm Technologies builds on a strong foundation of partnership and reflects our shared commitment to pushing the boundaries of what's possible," said Prasad Kalyanaraman, Vice President, AWS. "By working together on customized silicon and advanced connectivity, we're delivering more performant, efficient, and cost-effective infrastructure for our customers."
This collaboration marks a significant step toward building scalable, energy-efficient AI data center infrastructure. By integrating custom silicon and next-generation optical connectivity, Qualcomm and Amazon are positioned to meet the rising demands of AI workloads while enabling breakthrough performance and cost efficiency for cloud customers.
About Qualcomm
Qualcomm is a global computing leader at the center of the AI era, enabling intelligence to scale from the most personal devices to large‑scale infrastructure. Building on more than four decades of innovation, we develop platforms and solutions that bring together advanced AI, high‑performance, low-power computing and industry‑leading connectivity—powering products and services used around the world. At Qualcomm, we are engineering human progress.
