Fabric.AI, Inc., an AI infrastructure company developing a suite of fabless semiconductor technologies for next-generation AI factories, today announced that it expects to demonstrate its flagship Neural I/o MicroLED-based optical interconnect platform by the end of 2026. Neural I/o is being developed in partnership with Kopin Corporation and is designed to address the movement of data between GPUs, accelerators, memory systems, and servers inside AI data centers.
Fabric.AI targets Neural I/o MicroLED optical interconnect demonstration by end of 2026.
Developed in partnership with Kopin Corporation (Nasdaq:KOPN).
Entered two NDAs with leading chipmakers for potential integration of Neural I/o.
Company reports approximately $30 million in cash, sufficient to fund operations through demonstration milestone.
Market opportunity for next-generation AI interconnects could exceed $100 billion annually.
Fabric.AI listed on Nasdaq: FABC.
“AI is creating one of the largest infrastructure buildouts in modern history, and interconnect technology sits directly at the center of that expansion,” said Josh Silverman, Fabric.AI Chief Executive Officer. “The industry increasingly understands that AI performance is no longer determined solely by compute. It is determined by how efficiently data can move throughout the system. The industry has recognized that MicroLED-based interconnects can outperform both copper and laser-based architectures across power efficiency, thermals, density, latency, and scalability.
“We believe the market opportunity for next-generation AI interconnects could ultimately exceed $100 billion annually. In markets of this size, the leading technology platform often captures extraordinary value. Our goal with Neural I/o is to build a foundational technology layer for the AI factory era,” concluded Silverman.
Fabric.AI believes MicroLED-based interconnect architectures may offer substantial advantages over traditional copper and laser-based solutions, including lower power consumption, lower latency, improved thermal efficiency, greater density, and superior scalability for hyperscale AI environments.
As AI models continue scaling exponentially, industry leaders have increasingly emphasized that networking and interconnect performance are becoming critical constraints on AI system growth. NVIDIA founder and CEO Jensen Huang has repeatedly described networking as essential infrastructure for AI factories, stating that “the datacenter is the new unit of computing” and emphasizing that throughput and interconnect efficiency directly impact AI productivity and economics.
The Company's Neural I/o platform represents the first product initiative in Fabric.AI's broader strategy to build enabling semiconductor technologies for AI factories—smart data centers optimized for producing intelligence at scale.
Fabric.AI is an infrastructure company building a suite of fabless semiconductor technologies to power AI factories—smart data centers optimized for producing intelligence at scale. The Company's innovations include MicroLED-based optical interconnects and other system-critical technologies that enable faster, more efficient, and more scalable AI workloads. Fabric.AI's mission is to transform data centers into unified production systems for artificial intelligence.
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