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  • Enterprise AI

Credo Showcases AI Connectivity at 2025 OCP Global Summit


Credo Showcases AI Connectivity at 2025 OCP Global Summit
  • by: Source Logo
  • |
  • October 14, 2025

Credo Technology Group Holding Ltd, an innovator in secure, high-speed connectivity solutions, will showcase its technologies and vision for addressing system bandwidth bottlenecks in next-generation AI infrastructure at the 2025 OCP Global Summit. The event, held October 13-16 at the San Jose Convention Center, features demonstrations of Credo's latest optical, PCI Express (PCIe), and active electrical cable (AEC) products, along with executive presentations on advancing connectivity through ecosystem collaboration.

Quick Intel

  • Credo demonstrates ZeroFlap optical modules and AECs for enhanced reliability in scalable AI clusters at OCP Global Summit booth B23.
  • Features 1.6T 224G per lane ZeroFlap AECs supporting lossless backend RDMA networks essential for AI infrastructure.
  • Showcases Rubin Ultra NVL576 rack and Rubin NVL144 cluster fully cabled with 1.6T ZeroFlap AECs for zero link flaps.
  • Highlights Bluebird DSPs for 224Gbps PAM4 transmission with under 20W power and Lark 850 DSPs for 800G transceivers under 10W.
  • Toucan PCIe Gen6 retimers extend reach to 40dB with sub 7ns latency at 11W for GPUs, SmartNICs, and storage devices.
  • Executive session on October 14 discusses reinventing optical reliability for AI clusters with Credo CEO and Oracle Cloud engineer.

Credo’s booth demonstrations emphasize innovations like ZeroFlap Optical Modules, which incorporate built-in telemetry, in-band messaging, and diagnostics to achieve significant improvements in optical reliability for high-speed connectivity solutions.

The ZeroFlap AECs enable zero link flaps in 1.6T configurations, critical for the lossless networks powering AI clusters. Additional highlights include the PILOT telemetry platform, which provides rapid system bring-up, deep link visibility, and predictive signal integrity insights to prevent failures.

In the Innovation Village, Credo presents a Rubin NVL144 Cluster fully equipped with 1.6T ZeroFlap AECs, underscoring practical applications in AI infrastructure.

Key presentations include the executive session “The Path to Zero Flap: Reinventing Optical Reliability for Scalable AI Clusters” on Tuesday, October 14 at 1:15 p.m. in room 211, featuring Bill Brennan, President and CEO of Credo, and Stephen Manley, Senior Principal Network Engineer at Oracle Cloud. An expo session, “Wired for Success: Enhancing AI Cluster Reliability with Copper Cables,” follows at 4:20 p.m. in the Expo Hall Theater, led by Ameet Suri, AVP of Product for AECs at Credo.

These advancements in optical, PCIe, and AEC technologies, including power-efficient DSPs and retimers, position Credo to ease bandwidth constraints while enhancing reliability, security, and energy efficiency in AI-driven environments.

About Credo

Credo’s mission is to redefine high-speed connectivity by delivering breakthrough solutions that enable the next generation of AI-driven applications. We are committed to enabling faster, more reliable, more energy-efficient, and scalable solutions that support the ever-expanding demands of AI, cloud computing, and hyperscale networks. Our innovations ease system bandwidth bottlenecks while simultaneously improving on power, security, and reliability. Our connectivity solutions are optimized for optical and electrical Ethernet applications, including the emerging 100G (or Gigabits per second), 200G, 400G, 800G and the emerging 1.6T (or Terabits per second) port markets. Credo products are based on our proprietary Serializer/Deserializer (SerDes) and Digital Signal Processor (DSP) technologies. Our product families include Integrated Circuits (ICs) for the optical and line card markets, Active Electrical Cables (AECs) and SerDes Chiplets. Our intellectual property (IP) solutions consist primarily of SerDes IP licensing.

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