Infraeo has announced the appointment of Rakesh Sambaraju as President and Chief Executive Officer. His appointment reflects Infraeo's commitment to scaling rapidly in response to the explosive demand for interconnect technologies that enable high-performance AI infrastructure.
Rakesh Sambaraju appointed President and CEO of Infraeo.
20+ years of experience in optical communications and high-speed interconnects.
Previously held leadership roles at Sterlite Technologies, Nexans, and Corning.
Most recently served as Executive Vice President at Infraeo.
Will advance 1.6T optical and copper interconnects and near-package optics.
Holds Ph.D. in Optical Communications from Universitat Politècnica de València.
Dr. Sambaraju brings more than 20 years of experience across optical communications and high-speed interconnects, with a proven track record of translating advanced photonics research into commercial products at scale. Over his career, he has held technology and business development leadership roles at Sterlite Technologies, Nexans, and Corning, and most recently served as Executive Vice President at Infraeo. He holds a Ph.D. (summa cum laude), M.S., and B.Tech. in Optical Communications from the Universitat Politècnica de València.
Under Sambaraju's leadership, Infraeo will continue the evolution of its pluggable 1.6T optical and copper interconnect portfolio while advancing technology purpose-built for AI inferencing at the edge — including low-latency and long-reach options, as well as near-package optics applications. Together, these advances position Infraeo to support the full span of AI workloads, from centralized training clusters to distributed inference at the edge. As the industry evolves toward higher speeds for training and a transition to distributed AI inferencing, the company will invest in advanced optical technologies like NPO, CPO, and coherent optics.
"AI connectivity is seeing unprecedented growth, and I couldn't be more excited to lead Infraeo at such a pivotal moment for our industry. We have a very solid offering in this space today, with 800G and 1.6T AECs and optics. As the industry evolves toward higher speeds for training and a transition to distributed AI inferencing, I look forward to taking the company to the next level by investing in advanced optical technologies like NPO, CPO, and coherent optics," said Rakesh Sambaraju, President and CEO of Infraeo.
About Infraeo
Infraeo builds the physical AI networking copper and optical interconnects that carry AI's data. The company develops high-speed AI infrastructure interconnects based on DSO retimers and linear redriver ICs, photonic integrated circuits, and silicon photonics, delivering the copper and optical connectivity that links the GPU servers and racks powering AI data centers. Engineered for low power, low latency, and reliability at high-volume production scale, Infraeo's product portfolio serves the AI, data center, and enterprise networking markets — and advances the next generation of interconnect technology for training and inference at every scale.
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