SuperX AI Technology Limited, a NASDAQ-listed AI infrastructure solutions provider, has announced the launch of a new joint venture, SuperX Optical Communications Pte. Ltd., aimed at advancing high-speed optical interconnect technologies for next-generation AI computing. The venture is formed in collaboration with Suzhou TFC Optical Communication Co., Ltd.’s Singapore subsidiary and APEX VERVE LIMITED, marking a strategic expansion into silicon-photonics and optical module manufacturing.
The initiative strengthens SuperX’s position in the global AI infrastructure market by addressing critical supply chain dependencies in high-speed optical connectivity, which are essential for large-scale AI computing clusters.
The newly formed joint venture is structured with a registered capital of SGD 2 million and a multi-party governance model. SuperX holds a 45% stake, while TFC’s Singapore subsidiary and APEX VERVE LIMITED hold 35% and 20% respectively.
The venture integrates expertise across AI server infrastructure, optical device manufacturing, and global distribution channels to develop advanced optical interconnect solutions tailored for high-performance computing environments.
The joint venture has already introduced two silicon-photonics optical modules: the XOC 800G OSFP and XOC 1.6T OSFP. These transceivers are built on a 1310nm CW laser-based silicon-photonics integration architecture and support transmission distances of up to 500 meters over single-mode fiber.
Both products comply with OSFP MSA Rev. 5.0 and CMIS Rev. 5.1 standards and support Ethernet and InfiniBand protocols, making them suitable for AI supercomputing clusters and hyperscale data center deployments.
Demand for high-speed optical interconnects is accelerating as global investment in AI infrastructure continues to expand. Industry projections indicate that overseas AI infrastructure spending could exceed USD 470 billion by 2026, driving strong demand for 800G and 1.6T optical networking technologies.
SuperX is already active in AI server deployments across Europe, the United States, the Middle East, and Southeast Asia. However, reliance on externally sourced optical components has previously created supply chain constraints in cost, delivery, and system integration.
The joint venture aims to eliminate these bottlenecks by integrating TFC’s manufacturing expertise in silicon photonics and Co-Packaged Optics (CPO) with SuperX’s AI server ecosystem. This enables the development of fully integrated computing cluster solutions that combine servers, cooling systems, power infrastructure, and high-speed optical connectivity.
The company also highlighted that its new optical modules are designed for compatibility with NVIDIA’s next-generation CPO architectures, positioning the solution for advanced AI workloads.
SuperX plans to use the joint venture to support large-scale AI data center projects in the Middle East and Southeast Asia. The asset-light structure allows the company to secure stable access to high-end optical components without building dedicated manufacturing facilities, improving scalability and operational efficiency.
The initiative is expected to enhance the company’s ability to deliver turnkey AI infrastructure solutions globally, particularly for hyperscale computing environments.
SuperX’s optical joint venture represents a strategic move to strengthen its AI infrastructure stack by integrating high-speed silicon-photonics technology into its ecosystem. By addressing key supply chain constraints and advancing 800G and 1.6T connectivity solutions, the company aims to accelerate its role in powering next-generation AI data centers and global supercomputing deployments.
SuperX AI Technology Limited is an AI infrastructure solutions provider, offering a comprehensive portfolio of proprietary hardware, advanced software, and end-to-end services for AI data centers. The Company's services include advanced solution design and planning, cost-effective infrastructure product integration, and end-to-end operations and maintenance. Its core products include high-performance AI servers, 800 Volts Direct Current (800VDC) solutions, high-density liquid cooling solutions, as well as AI cloud and AI agents. Headquartered in Singapore, the Company serves institutional clients globally, including enterprises, research institutions, and cloud and edge computing deployments. For more information, please visit www.superx.sg
TechIntelPro empowers B2B technology decision-makers with the latest industry trends, deep insights, leadership perspectives and actionable intelligence to drive both organizational and professional milestones, and thrive on the tech pulse.
