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Samsung and AMD Sign MOU to Advance Next-Gen AI Memory and Computing


Samsung and AMD Sign MOU to Advance Next-Gen AI Memory and Computing
  • by: Source Logo
  • |
  • March 19, 2026

Samsung Electronics and AMD have signed a Memorandum of Understanding to deepen their strategic collaboration on next-generation AI memory and computing technologies. The agreement focuses on high-bandwidth memory (HBM4), advanced DRAM solutions, and potential foundry partnerships to power AMD's upcoming AI accelerators and data center platforms. The signing took place at Samsung’s advanced chip manufacturing complex in Pyeongtaek, Korea, with senior leadership from both companies in attendance.

Quick Intel

  • Samsung and AMD expand collaboration via MOU targeting HBM4 supply for AMD Instinct MI455X GPU and advanced DRAM for 6th Gen AMD EPYC “Venice” CPUs.
  • Samsung’s HBM4, built on 1c 10nm-class DRAM and 4nm logic base die, delivers up to 13 Gbps speeds and 3.3 TB/s bandwidth for superior AI performance and efficiency.
  • The partnership supports AMD’s Helios rack-scale architecture, combining Instinct GPUs, EPYC CPUs, and optimized memory for scalable AI infrastructure.
  • Companies will collaborate on high-performance DDR5 memory tailored for next-gen EPYC processors in AI and data center workloads.
  • Discussions include potential Samsung foundry services for future AMD products, building on nearly two decades of joint work in graphics, mobile, and computing.
  • Samsung has been the primary HBM3E partner for AMD’s recent Instinct MI350X and MI355X accelerators, continuing leadership in AI memory supply.

Samsung and AMD are strengthening their long-standing partnership to address the growing demands of AI infrastructure, where memory bandwidth, power efficiency, and system integration play critical roles in performance.

Focus on HBM4 for Next-Generation AI Accelerators

Under the MOU, Samsung will serve as the primary supplier of HBM4 for AMD’s upcoming Instinct MI455X GPU. Samsung’s HBM4 leverages its most advanced 6th-generation 10nm-class (1c) DRAM process combined with a 4nm logic base die, achieving industry-leading speeds of up to 13 Gbps and maximum bandwidth of 3.3 TB/s. This technology provides exceptional performance, reliability, and energy efficiency, making the MI455X an optimal choice for large-scale AI model training and inference.

The MI455X GPU will integrate into AMD’s Helios rack-scale architecture, enabling high-performance, scalable systems designed for demanding AI workloads.

Advanced DRAM and DDR5 Optimization for EPYC Platforms

The collaboration extends to next-generation DRAM solutions, including high-performance DDR5 memory optimized for the 6th Gen AMD EPYC processors, codenamed “Venice.” These memory advancements will enhance system-level efficiency in data centers and AI environments built on AMD’s rack-scale platforms.

Exploring Foundry Opportunities

The MOU also opens discussions on Samsung providing foundry services for future AMD products, further integrating Samsung’s manufacturing expertise with AMD’s processor roadmap.

“Samsung and AMD share a commitment to advancing AI computing, and this agreement reflects the growing scope of our collaboration,” said Young Hyun Jun, Vice Chairman & CEO of Samsung Electronics. “From industry-leading HBM4 and next-generation memory architectures to cutting-edge foundry and advanced packaging, Samsung is uniquely positioned to deliver unrivaled turnkey capabilities that support AMD’s evolving AI roadmap.”

“Powering the next generation of AI infrastructure requires deep collaboration across the industry,” said Dr. Lisa Su, Chair and CEO of AMD. “We are thrilled to expand our work with Samsung, bringing together their leadership in advanced memory with our Instinct GPUs, EPYC CPUs and rack-scale platforms. Integration across the full computing stack, from silicon to system to rack, is essential to accelerating AI innovation that translates into real-world impact at scale.”

This expanded partnership builds on nearly two decades of collaboration, including Samsung’s role as the primary HBM3E supplier for AMD’s Instinct MI350X and MI355X accelerators. By aligning on memory innovation and potential foundry support, Samsung and AMD aim to deliver more powerful, efficient AI solutions for cloud, enterprise, and hyperscale customers.

 

About Samsung Electronics Co., Ltd. 

Samsung inspires the world and shapes the future with transformative ideas and technologies. The company is redefining the worlds of TVs, digital signage, smartphones, wearables, tablets, home appliances and network systems, as well as memory, system LSI and foundry. Samsung is also advancing medical imaging technologies, HVAC solutions and robotics, while creating innovative automotive and audio products through Harman. With its SmartThings ecosystem, open collaboration with partners, and integration of AI across its portfolio, Samsung delivers a seamless and intelligent connected experience. For the latest news, please visit the Samsung Newsroom at news.samsung.com.

 

About AMD 

AMD (NASDAQ: AMD) drives innovation in high-performance and AI computing to solve the world’s most important challenges. Today, AMD technology powers billions of experiences across cloud and AI infrastructure, embedded systems, AI PCs and gaming. With a broad portfolio of AI-optimized CPUs, GPUs, networking and software, AMD delivers full-stack AI solutions that provide the performance and scalability needed for a new era of intelligent computing.

  • AI ComputingAMD InstinctSamsung AMD
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