.jpg)
Kioxia America, Inc. has started sample shipments of its 512Gb Triple-Level Cell (TLC) memory devices, utilizing the 9th generation BiCS FLASH 3D flash memory technology. This advancement, aimed at mass production in fiscal year 2025, targets applications demanding high performance and power efficiency, particularly in AI-driven systems and enterprise SSDs.
Kioxia’s 9th generation BiCS FLASH 512Gb TLC memory, built on a 120-layer stacking process and CMOS directly Bonded to Array (CBA) technology, delivers significant performance enhancements. With a 61% improvement in write speeds, 12% in read speeds, and up to 36% better power efficiency during writes, this memory is optimized for AI workloads, enterprise SSDs, and edge devices.
Kioxia pursues a dual-axis approach to meet diverse market needs:
This strategy ensures Kioxia delivers cost-effective, high-performance solutions tailored to current and emerging applications.
The 9th generation BiCS FLASH 512Gb TLC achieves an 8% increase in bit density through planar scaling and supports a high-speed Toggle DDR6.0 interface at 3.6Gb/s, with demonstrated NAND interface speeds up to 4.8Gb/s. These improvements make it ideal for applications requiring consistent throughput and thermal efficiency, such as GPU-based AI systems and industrial embedded solutions.
“Kioxia continues to pursue a dual-axis strategy to address the diverse needs of cutting-edge applications while delivering competitive products providing optimal investment efficiency,” the company stated. By integrating these devices into enterprise SSDs, Kioxia aims to enhance GPU efficiency for AI systems, supporting the growing demand for reliable, high-performance storage in data-intensive environments.
Kioxia’s latest BiCS FLASH technology reinforces its leadership in memory solutions, driving innovation for AI, cloud storage, and other read-heavy applications while strengthening global partnerships.
KIOXIA America, Inc. is the U.S.-based subsidiary of KIOXIA Corporation, a leading worldwide supplier of flash memory and solid-state drives (SSDs). From the invention of flash memory to today’s breakthrough BiCS FLASH™ 3D technology, KIOXIA continues to pioneer innovative memory, SSD and software solutions that enrich people's lives and expand society's horizons. The company's innovative 3D flash memory technology, BiCS FLASH, is shaping the future of storage in high-density applications, including advanced smartphones, PCs, automotive systems, data centers and generative AI systems.
© 2025 KIOXIA America, Inc. All rights reserved. Information in this press release, including product pricing and specifications, content of services, and contact information is current and believed to be accurate on the date of the announcement, but is subject to change without prior notice. Technical and application information contained here is subject to the most recent applicable KIOXIA product specifications.
TechIntelPro empowers B2B technology decision-makers with the latest industry trends, deep insights, leadership perspectives and actionable intelligence to drive both organizational and professional milestones—and thrive on the tech pulse.