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  • Enterprise AI

Endura Technologies Names Michael Brunolli Head of R&D


 Endura Technologies Names Michael Brunolli Head of R&D
  • by: Source Logo
  • |
  • September 23, 2025

Endura Technologies, a global leader in high-performance power management solutions, has appointed Michael Brunolli as Head of Research and Development. With over 40 years of expertise in advanced system design and commercialization, Brunolli will drive innovation in power delivery for next-generation hyperscale AI data centers, scaling the company's breakthrough VFIVR technology to meet exponential AI workload demands.

Quick Intel

  • Endura Technologies appoints Michael Brunolli as Head of R&D.
  • Brunolli brings 40+ years in analog and high-speed mixed-signal design.
  • Previously VP of Technology at Qualcomm and CTO at Rapid Bridge.
  • Focus on scaling 150MHz VFIVR for AI factories, targeting 300MHz IVR next.
  • Addresses power efficiency challenges in SoCs, GPUs, and chiplets.
  • Holds 40+ patents and co-founded startups like Nurlogic.

Brunolli's Proven Track Record in Innovation

Michael Brunolli joins Endura Technologies with a distinguished career spanning leadership roles at Qualcomm, where he drove strategic innovation and growth as VP of Technology. Prior to that, as CTO and co-inventor at Rapid Bridge, he developed power-saving CPR technology, culminating in its acquisition by Qualcomm. Earlier, as co-founder and CTO of Nurlogic, Brunolli pioneered advancements in I/O and PLL design, contributing to AMD's Athlon processor and a 72-channel optical link. His extensive patent portfolio—over 40 inventions—and experience founding successful startups position him to tackle the physics and business of power innovation for AI infrastructure.

Scaling VFIVR for AI Data Centers

Endura Technologies' 150MHz silicon-proven Vertically Fully Integrated Voltage Regulator (VFIVR) delivers industry-leading current density and ultra-high control bandwidth, directly addressing energy efficiency challenges in AI factories. As hyperscale computing pushes compute limits, VFIVR enables significant performance gains with seamless integration into 2.5D and 3D architectures for SoCs, GPUs, and chiplets. Brunolli's appointment accelerates the development of the next-generation 300MHz IVR architecture, ensuring reliable power systems that scale with massive workloads.

“As AI workloads grow exponentially, pushing the limits of compute, the industry needs leaders who understand both the physics and the business of power innovation,” said Dr. Massih Tayebi, CEO of Endura Technologies. “I’ve had the privilege of working with Michael for nearly two decades. His unmatched expertise and proven execution will be pivotal as we scale our breakthrough VFIVR technology and shape the next generation of power delivery for hyperscale AI.”

“The next generation of AI infrastructure and compute depend on reliable power systems that can scale with massive workloads,” said Michael Brunolli, Head of R&D at Endura Technologies. “I am excited to join Endura Technologies at such a pivotal moment in the industry and look forward to helping bring Endura Technologies’ disruptive technology into production to power the next wave of AI-driven data centers.”

Brunolli's leadership will expand Endura's vision for powering AI factories, leveraging its patented, agnostic digital architecture to overcome traditional power delivery limitations. This includes ultra-high switching frequency, fast transient response, and low ripple, essential for advanced process nodes and energy-efficient AI systems.

About Endura Technologies

Endura Technologies develops ultra-high density power management solutions to efficiently power advanced SoCs, GPUs and chiplets. Its patented, agnostic digital architecture is engineered to scale with advanced process nodes to meet the growing demands of tomorrow's AI factories. By offering industry-leading current density, ultra-high switching frequency, ultra-fast transient response and ultra-low ripple, Endura Technologies' solutions effectively overcome the physical limitations of traditional power delivery solutions, enabling seamless integration into next-generation 2.5D and 3D AI system architectures.

  • AI PowerSemiconductorVFIVREndura TechR&D Leadership
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