Digi Power X Inc., a leader in AI and digital infrastructure, has announced that its subsidiary, US Data Centers, Inc., has filed a provisional utility patent for its ARMS 200 platform. This modular AI data center solution is designed to support high-density GPU clusters, marking a significant step in scalable AI infrastructure.
US Data Centers, Inc., a Digi Power X subsidiary, files provisional patent for ARMS 200.
ARMS 200 supports 1 MW of compute capacity with up to 256 NVIDIA B200/B300 GPUs.
Platform features Tier 3-certified design with liquid cooling and dual-path power redundancy.
Scalable to 40 MW at Alabama site, supporting 10,240 NVIDIA GPUs.
Developed with Supermicro, optimized for NVIDIA Blackwell-class architecture.
Initial deployment planned for Q4 2025, with ARMS 300 and 400 platforms in development.
The ARMS 200 (AI-Ready Modular Solution) platform is a Tier 3-certified modular data center engineered for high-performance AI workloads. Each pod delivers 1 megawatt of compute capacity and can house up to 256 NVIDIA B200 or B300 GPUs. The platform is optimized for rapid deployment, catering to enterprise, sovereign, and cloud-scale AI applications. Its modular design allows for flexible scaling, making it a versatile solution for organizations looking to enhance their AI infrastructure.
Digi Power X has partnered with Super Micro Computer, Inc. to develop the ARMS 200 platform, leveraging Supermicro’s expertise in high-performance computing systems. The platform integrates NVIDIA’s Blackwell-class architecture, ensuring compatibility with cutting-edge GPU technology. A prior purchase order for NVIDIA B200-powered systems will seed the initial deployment, scheduled for the fourth quarter of 2025. This collaboration strengthens Digi Power X’s position in the AI infrastructure market.
The ARMS 200 platform is designed to scale efficiently, with plans to reach 40 MW of critical power at Digi Power X’s Alabama site, supporting approximately 10,240 NVIDIA GPUs. It incorporates advanced features such as liquid cooling and dual-path power redundancy for enhanced reliability. The platform also includes NeoCloud orchestration, enabling GPU-as-a-Service operations, which simplifies access to high-performance computing resources for businesses and organizations.
The provisional patent filing for ARMS 200 is the first in a series of modular systems under development by US Data Centers, Inc. The upcoming ARMS 300 and ARMS 400 platforms will target hyperscale enterprise and government-grade AI infrastructure, further expanding Digi Power X’s portfolio. “This provisional patent is the first step to protect the foundational architecture of our ARMS 200 platform,” said Michel Amar, Chief Executive Officer. “Combined with our Supermicro partnership and Tier 3-certified design, we are positioning ourselves to scale the ARMS 200 from first deployments expected later this year into a full-fledged AI infrastructure network.”
Digi Power X’s ARMS 200 platform represents a significant advancement in modular AI data center technology. With its scalable design, strategic partnerships, and focus on high-performance computing, the company is poised to meet the growing demand for AI infrastructure across industries.
Digi Power X is a next-generation AI infrastructure company that designs and deploys modular Tier 3-certified compute through its patent-pending ARMS platform and offers enterprise-grade GPU compute through its NeoCloud GPU-as-a-Service ecosystem, leveraging advanced NVIDIA GPU technology and secured energy infrastructure. As of July 28, 2025, Digi Power X maintains over $30 million in cash and cash equivalents with no long-term debt on its balance sheet, positioning the Company for growth and commercialization of its modular AI data center platform.
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