Credo Technology Group Holding Ltd (Credo), a leader in secure, high-speed connectivity solutions focused on improved reliability and energy efficiency, announced its participation in the Arm Total Design ecosystem. This strategic collaboration is set to combine Arm’s world-class processor architecture with Credo’s leading-edge connectivity IP to enable the rapid development of customized semiconductor solutions for next-generation AI, cloud computing, and hyperscale data center applications.
Credo brings its high-speed SerDes and mixed-signal DSP IP portfolio, including SerDes chiplets, to the Arm Total Design ecosystem.
The partnership aims to accelerate the design of custom silicon optimized for demanding AI workloads and hyperscale data centers.
The combination of Credo IP with the Arm Neoverse Compute Subsystems (CSS) provides essential building blocks for high-performance, low-power infrastructure.
This ecosystem simplifies the development process for partners building specialized, energy-efficient solutions for the AI era.
Credo's comprehensive SerDes IP family supports signaling options from 28G to 224G, ensuring high-reliability connectivity.
Joining the ecosystem reinforces a commitment to industry collaboration to address the complexity and speed required for bringing cutting-edge semiconductor technologies to market.
Credo's contribution to the Arm Total Design ecosystem centers on its industry-leading SerDes and mixed-signal Digital Signal Processor (DSP) IP portfolio. Specifically, this includes the offering of its SerDes chiplets. This integration allows system architects and chip designers to leverage Credo's expertise in high-speed interconnects alongside the high-performance capabilities of the Arm processor architecture. This is crucial for applications that demand massive data throughput, particularly in AI data centers where latency and bandwidth are critical limiting factors.
The Arm Total Design initiative provides a robust, multivendor chiplet ecosystem designed to simplify and speed up the development of custom silicon utilizing Arm Neoverse Compute Subsystems (CSS). For Credo’s customers, this means they can more easily collaborate with multiple industry partners to rapidly innovate. The synergy between Neoverse CSS and Credo’s connectivity solutions offers the foundational processing and high-speed data transfer components required to build optimized, high-performance, and low-power infrastructure essential for the data centers of the future and the intense computational needs of AI workloads.
Industry leaders recognize the necessity of such collaborative ecosystems to meet rising compute demands. Eddie Ramirez, vice president of go-to-market, Infrastructure Business, Arm, highlighted the fit, stating: "Credo’s leadership in high-speed connectivity and chiplet innovation is a great fit for the Arm Total Design ecosystem and will help our mutual partners accelerate their path toward scalable, efficient AI systems."
This sentiment was echoed by Credo, reinforcing the value of the partnership in addressing market challenges. Jeff Twombly, vice president of business development, Credo, commented: "Arm Total Design demonstrates Arm’s leadership in addressing the evolving challenges that the industry faces in bringing cutting-edge semiconductor technologies to market quickly."
Credo's high-performance, energy-efficient IP is structured for straightforward integration into customer-specific ASIC designs or as chiplets for use in Multichip Module System on Chip (MCM SoC) and 2.5D Silicon Interposer designs. The company’s extensive SerDes IP family offers broad flexibility with signaling options that span from 28G to 224G. Furthermore, the portfolio includes various reach options to meet different physical requirements, such as long reach plus (LR+), long reach (LR), medium reach (MR), and very short reach plus (VSR), ensuring reliable and scalable connectivity across diverse system configurations.
In conclusion, Credo’s integration into the Arm Total Design ecosystem marks a significant step toward streamlining the development of specialized, energy-efficient silicon solutions. By combining advanced processing and cutting-edge high-speed connectivity, the partnership is poised to directly address the increasing performance and efficiency demands driven by the proliferation of massive AI, cloud, and hyperscale data center applications.
Credo’s mission is to redefine high-speed connectivity by delivering breakthrough solutions that enable the next generation of AI-driven applications. We are committed to enabling faster, more reliable, more energy-efficient, and scalable solutions that support the ever-expanding demands of AI, cloud computing, and hyperscale networks. Our innovations ease system bandwidth bottlenecks while simultaneously improving on power, security, and reliability. Our connectivity solutions are optimized for optical and electrical Ethernet applications, including the emerging 100G (or Gigabits per second), 200G, 400G, 800G and the emerging 1.6T (or Terabits per second) port markets. Credo products are based on our proprietary Serializer/Deserializer (SerDes) and Digital Signal Processor (DSP) technologies. Our product families include Integrated Circuits (ICs) for the optical and line card markets, Active Electrical Cables (AECs) and SerDes Chiplets. Our intellectual property (IP) solutions consist primarily of SerDes IP licensing.
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