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  • Drut Technologies, Ranovus Launch AI-Optimized CPO Solution
  • Edge AI

Drut Technologies, Ranovus Launch AI-Optimized CPO Solution


Drut Technologies, Ranovus Launch AI-Optimized CPO Solution
  • Source: Source Logo
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  • June 19, 2025

Drut Technologies and Ranovus Inc. announced a collaboration to deliver a co-packaged optics (CPO) solution, integrating Ranovus’s ODIN® CPO technology with Drut’s 2500 series. This partnership aims to transform data center infrastructure for artificial intelligence (AI), machine learning (ML), and high-performance computing (HPC) workloads by addressing bandwidth, density, and power efficiency challenges.

Quick Intel

  • Drut Technologies and Ranovus collaborate on CPO for AI, ML, and HPC.

  • Drut’s 2500 series integrates Ranovus’s ODIN® CPO technology.

  • Enables PCIe Gen 5 servers with full x16 line speed of 32G per serdes.

  • Reduces power consumption and footprint while boosting performance.

  • Supports PCIe Gen 5/6/7 and 100Gbps/200Gbps Ethernet connectivity.

  • Addresses rising demand for scalable, high-density data center solutions.

Revolutionizing Data Center Infrastructure

Drut Technologies focuses on enabling dynamic, software-defined photonic infrastructure for AI, ML, and HPC workloads. Its 2500 series, one of the first commercially available CPO solutions, connects PCIe Gen 5 servers to photonic fabrics at full x16 line speed (32G per serdes). By integrating Ranovus’s ODIN® CPO technology, the solution overcomes traditional electrical interconnect limitations, offering higher bandwidth, lower latency, and reduced power consumption.

“We are thrilled to partner with Drut to bring the transformative benefits of our CPO technology to their game-changing 2500 series,” said Hojjat Salemi, Chief Business Development Officer at Ranovus. “Drut’s unwavering focus on pushing the boundaries of network performance aligns perfectly with our mission to revolutionize data center interconnect.”

Industry-Disrupting CPO Technology

Ranovus’s ODIN® CPO platform integrates lasers, modulators, photodetectors, and control circuits into a monolithic Electro-Photonic Integrated Circuit (EPIC). This design delivers scalable, high-density optical interconnects for PCIe Gen 5/6/7 and 100Gbps/200Gbps Ethernet, significantly reducing power and footprint compared to traditional solutions. Drut’s 2500 series leverages this technology to enhance GPU connectivity and resource utilization, enabling dynamic infrastructure that adapts to evolving workloads.

“Ranovus’s ODIN® CPO technology is a true industry disruptor,” said William R. Koss, CEO and President of Drut Technologies. “Integrating their solution into our 2500 series allows us to deliver unparalleled levels of performance and density while significantly reducing power consumption and footprint.”

Meeting Growing Data Center Demands

As AI and ML applications drive unprecedented data center traffic, the need for efficient, scalable interconnects intensifies. The Drut-Ranovus collaboration addresses these challenges by combining Drut’s photonic fabric architecture with Ranovus’s advanced silicon photonics and Multi-Wavelength Quantum Dot Laser technology. This partnership enables sustainable, high-performance infrastructure for hyperscale and enterprise data centers, supporting up to 32 GPUs per host and optimizing resource allocation.

Strategic Impact

The collaboration builds on Drut’s DynamicXcelerator platform and Ranovus’s expertise in optical interconnects, delivering a solution that eliminates vendor lock-in and supports multi-vendor AI cloud environments. By enhancing performance and reducing costs, this CPO solution positions Drut and Ranovus as leaders in next-generation data center infrastructure for AI-driven workloads.

 

About Drut

Drut Technologies Inc. is at the forefront of photonic data center solutions and is dedicated to revolutionizing data center architecture through innovative, high-performance products. Based in Nashua, New Hampshire, Drut is committed to empowering businesses with next-generation data center technologies. 

About Ranovus

Ranovus has assembled a multidisciplinary team of industry experts spanning optoelectronic subsystems, lasers, silicon photonics, RF, mixed-signal ASICs, advanced packaging, high-volume manufacturing, system design, and technology commercialization. Together, we are addressing some of the most complex challenges in optical interconnects for AI/ML workloads.

Our industry-leading Odin® Co-Packaged Optics platform integrates all key analog components of an optical engine—lasers, modulators, photodetectors, drivers, transimpedance amplifiers, and control loops—into a compact monolithic Electro-Photonic Integrated Circuit (EPIC). This scalable solution is designed for Co-Packaged Optics, Near-Packaged Optics, and Module applications.

Ranovus delivers Application-Specific Optical Engines (ASOE) to the AI compute industry through a portfolio of highly efficient and scalable IP cores. By leveraging Multi-Wavelength Quantum Dot Laser technology and cutting-edge silicon photonics and digital integrated circuits, we are setting new industry benchmarks for power efficiency, size, and cost, thereby accelerating the transition from copper to optical interconnect solutions.

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